BOND LEAD FREE SOLDERS

Specification:

  • Highly reliable solder joints and fast wetting
  • Bridge free wave soldering at 255-265˚C
  • Excellent flows and low solder defects
  • Lowest dross formation and high yield rate
  • Suitable for soldering of all types of components and printed circuit boards
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Description

Description:

BOND PRODUCT CODE : LF 2

BOND COMPOSITION: Sn96.5/Ag3.0/Cu0.5
( SAC 305 )