BOND LEAD FREE SOLDERS – LF 8

Specification:

  • Highly reliable solder joints and fast wetting
  • Bridge free wave soldering at 255-265˚C
  • Excellent flows and low solder defects
  • Lowest dross formation and high yield rate
  • Suitable for soldering of all types of components and printed circuit boards

Description

Description:

BOND PRODUCT CODE : LF 8

BOND COMPOSITION: Sn99.7/Ag0.3
( SAC 0300 )