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lead free soldering ball for BGA reballing

Quick Details –
Place of Origin:Guangdong, China
Brand Name:mechanic
Model Number:solder ball
OEM:welcome
shape:tin ball
application:BGA PCBs
material:tin
packing:bottle
diameter:0.2;0.25;0.3;0.35;0.4;0.45;0.5;0.55;0.6;0.76mm
alloy:Sn63Pb37
purity:99.99%Sn
name:bga solder ball
Product name:lead free soldering ball for BGA reballing
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