Bond Solder Wire-SnPb-Sn60/Pb40

Specification:

  • The flux is peripherally arranged, so it will obviously react and flow faster.
  • Wetting is faster, complete and uniform which means that you use less solder and transmit less heat to the joint area.
  • Since single core solder can frequently have flux voids, this problem will not be in multicore. Therefore, you can depend on continuity of the flux stream for complete wetting.
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Description

Description:

BOND PRODUCT CODE : SnPb

BOND COMPOSITION: Sn60/Pb40