Bond Solder Wire-rma-Sn/ Zn-Sn 70/ ZN 30

Specification:

  • The flux is peripherally arranged, so it will obviously react and flow faster.
  • Wetting is faster, complete and uniform which means that you use less solder and transmit less heat to the joint area.
  • Since single core solder can frequently have flux voids, this problem will not be in multicore. Therefore, you can depend on continuity of the flux stream for complete wetting.

Description

Description:

BOND PRODUCT CODE : Sn/ Zn

BOND COMPOSITION: Sn 70/ ZN 30