Bond Solder Paste - Sn/Pb/Ag (62/36/2)
Bond Solder Glue- Sn/Ag/Cu (96.5/3.0/0.5)

Bond Solder Paste – Sn/Pb/Ag (63/36.6/0.4)

FEATURES:

  • Exhibits excellent wettability.
  • Ensures minimal slumping and prevents solder balling and bridging.
  • Transparent flux residue offers superior cosmetic appearance.
  • No post solder cleaning requirement saves process time and cost
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Description

MELTING POINT °C : 179-190

PARTICLE SIZE (µm ): T4-22-38/ T3- 22~ 45

SHAPE: SPHERICAL

FLUX CONTENT:10 ±0.50 %

VISCOSITY: 190±20

SPREAD (%):>90

COPPER CORROSION TEST: PASSED

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