Bond Solder Glue- Sn/Ag/Cu/Bi (96.2/0.3/0.5/3.0)
Bond Pure Anodes & Tin Anodes - Pb

Bond Solder Glue- Sn/Bi (42/58)

FEATURES:

  • Excellent adhesion and fast curing
  • Low moisture absorption
  • Stable at high speed dispensing / screen printing
  • Good bonding strength
  • Greater surface insulation resistance
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Description

MELTING POINT °C : 138

PARTICLE SIZE (µm ): 22 ~ 38

SHAPE: SPHERICAL

FLUX CONTENT: 11±0.5 %

VISCOSITY: 180±20

SPREAD (%): >75

COPPER CORROSION TEST: PASSED

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