Bond Solder Glue- Sn/Bi (42/58)

FEATURES:

  • Excellent adhesion and fast curing
  • Low moisture absorption
  • Stable at high speed dispensing / screen printing
  • Good bonding strength
  • Greater surface insulation resistance

Description

MELTING POINT °C : 138

PARTICLE SIZE (µm ): 22 ~ 38

SHAPE: SPHERICAL

FLUX CONTENT: 11±0.5 %

VISCOSITY: 180±20

SPREAD (%): >75

COPPER CORROSION TEST: PASSED