Bond Solder Glue- Sn/Ag/Cu/Bi (96.2/0.3/0.5/3.0)

FEATURES:

  • Excellent adhesion and fast curing
  • Low moisture absorption
  • Stable at high speed dispensing / screen printing
  • Good bonding strength
  • Greater surface insulation resistance

Description

MELTING POINT °C : 207-224

PARTICLE SIZE (µm ): 38 ~ 22

SHAPE: SPHERICAL

FLUX CONTENT: 12±0.5 %

VISCOSITY: 200±20

SPREAD (%): >75

COPPER CORROSION TEST: PASSED