Bond Solder Glue- Sn/Ag/Cu (96.5/3.0/0.5)

FEATURES:

  • Excellent adhesion and fast curing
  • Low moisture absorption
  • Stable at high speed dispensing / screen printing
  • Good bonding strength
  • Greater surface insulation resistance
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Description

MELTING POINT °C : 217-221

PARTICLE SIZE (µm ): T4 – 38 ~22/ T5- 10 ~ 25

SHAPE: SPHERICAL

FLUX CONTENT: 11.5±0.3 %

VISCOSITY: 200±20

SPREAD (%): >75

COPPER CORROSION TEST: PASSED