BOND LEAD FREE SOLDERS – LF 11

Specification:

  • Highly reliable solder joints and fast wetting
  • Bridge free wave soldering at 255-265˚C
  • Excellent flows and low solder defects
  • Lowest dross formation and high yield rate
  • Suitable for soldering of all types of components and printed circuit boards

Description

Description:

BOND PRODUCT CODE : LF 11

BOND COMPOSITION: Sn99.2/Cu0.6/Ag0.1
( SAC 0107 )